Accelerating System Innovation with the Revolutionary 3D-IC Platform

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10-15-2021 | Cadence | Design and manufacture

Cadence Design Systems launched the Cadence Integrity 3D-IC platform, claimed to be the industry’s first comprehensive, high-capacity 3D-IC platform that combines 3D design planning, implementation and system analysis. in a single unified cockpit. The platform underpins the company’s third-generation 3D-IC solution, providing customers with system-driven power, performance, and surface area for individual chips through built-in thermal analysis, power and static synchronization.

Chip designers creating large-scale, consumer, 5G communications, mobile, and automotive computing applications can deliver greater productivity with the platform compared to a messy implementation approach. The platform uniquely offers system planning, integrated electrothermal and static analysis of time and physical verification flows, facilitating faster, high-quality 3D design closure. It also includes 3D exploration workflows, which use 2D design netlists to produce multiple 3D stacking scenarios based on user input, automatically selecting the optimal final 3D stacked configuration. Additionally, the platform’s database supports all types of 3D design, allowing engineers to create designs at multiple process nodes simultaneously and achieve seamless co-design with case design teams. and outsourced semiconductor assembly and testing companies that use Cadence Allegro packaging technologies.

“Cadence has always offered strong 3D-IC packaging solutions to its customers through its core digital, analog and package implementation product lines,” said Dr. Chin-Chi Teng, senior vice president and general manager of the Digital and Signoff group at Cadence. “With recent developments in advanced packaging technologies, we have seen the need to build further on our successful 3D-IC foundation, providing a more tightly integrated platform that combines our implementation technology with planning. and system level analysis. As the industry continues to evolve into different 3D stacked die configurations, the new Integrity 3D-IC platform enables customers to achieve system-driven PPA, reduced design complexity, and time to time. the market faster.


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